Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764124 | Sensing component encapsulated by an encapsulant with a roughness surface having a hollow region | Yung-Chi Chu, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2023-09-19 |
| 11600592 | Package | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2023-03-07 |