Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854997 | Method of forming semiconductor device | Jhih-Yu Wang, Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2023-12-26 |
| 11798857 | Composition for sacrificial film, package, manufacturing method of package | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2023-10-24 |
| 11798893 | Semiconductor package and manufacturing method thereof | Hung-Jui Kuo, Jhih-Yu Wang, Yu-Hsiang Hu | 2023-10-24 |
| 11764124 | Sensing component encapsulated by an encapsulant with a roughness surface having a hollow region | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao, Tian Hu | 2023-09-19 |
| 11694967 | Package structure and method of fabricating the same | Jhih-Yu Wang, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2023-07-04 |