Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854997 | Method of forming semiconductor device | Yung-Chi Chu, Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2023-12-26 |
| 11798893 | Semiconductor package and manufacturing method thereof | Yung-Chi Chu, Hung-Jui Kuo, Yu-Hsiang Hu | 2023-10-24 |
| 11694967 | Package structure and method of fabricating the same | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao, Yung-Chi Chu | 2023-07-04 |