Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11682647 | Semiconductor package and method for manufacturing the same | Po-Han Wang, Hung-Jui Kuo, Shih-Peng Tai, Yu-Hsiang Hu | 2023-06-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11682647 | Semiconductor package and method for manufacturing the same | Po-Han Wang, Hung-Jui Kuo, Shih-Peng Tai, Yu-Hsiang Hu | 2023-06-20 |