Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11682647 | Semiconductor package and method for manufacturing the same | Po-Han Wang, Hung-Jui Kuo, Yu-Hsiang Hu, I-Chia Chen | 2023-06-20 |
| 11626341 | Package structure | Shih-Hui Wang, Der-Chyang Yeh, Tsung-Shu Lin, Yi-Chung Huang | 2023-04-11 |
| 11587887 | Semiconductor device and manufacturing method thereof | Yu-Wei Lin, Chun-Yen Lan, Tzu-Ting Chou, Tzu-Shiun Sheu, Chih-Wei Lin +2 more | 2023-02-21 |