Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842902 | Semiconductor package with alignment mark and manufacturing method thereof | Hung-Jui Kuo, Yu-Hsiang Hu | 2023-12-12 |
| 11817352 | Method of fabricating redistribution circuit structure | Yu-Hsiang Hu, Hung-Jui Kuo | 2023-11-14 |
| 11688703 | Methods of fabricating semiconductor devices having conductive pad structures with multi-barrier films | Po-Hsun Huang, Ing-Ju Lee, Chao-Lung Chen, Cheng-Ming Wu | 2023-06-27 |
| 11682647 | Semiconductor package and method for manufacturing the same | Hung-Jui Kuo, Shih-Peng Tai, Yu-Hsiang Hu, I-Chia Chen | 2023-06-20 |
| 11682636 | Info structure and method forming same | Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu | 2023-06-20 |
| 11664323 | Semiconductor package and method | Hung-Jui Kuo, Yu-Hsiang Hu | 2023-05-30 |
| 11570709 | BLE and/or WiFi compliant and blocker-resilient wake-up receiver and method | Patrick Mercier | 2023-01-31 |