Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11688703 | Methods of fabricating semiconductor devices having conductive pad structures with multi-barrier films | Po-Hsun Huang, Po-Han Wang, Ing-Ju Lee, Cheng-Ming Wu | 2023-06-27 |