Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11688703 | Methods of fabricating semiconductor devices having conductive pad structures with multi-barrier films | Po-Hsun Huang, Po-Han Wang, Chao-Lung Chen, Cheng-Ming Wu | 2023-06-27 |
| 11598016 | Electrochemical plating system and method of using | Jun-Nan Nian, Shiu-Ko JangJian, Ting-Chun Wang | 2023-03-07 |