Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784240 | Semiconductor device structure with barrier layer | Chia-Yang Wu, Ting-Chun Wang, Yung-Si Yu | 2023-10-10 |
| 11670704 | Semiconductor device structure with barrier layer | Chia-Yang Wu, Ting-Chun Wang, Yung-Si Yu | 2023-06-06 |
| 11603602 | Method for controlling electrochemical deposition to avoid defects in interconnect structures | Jun-Nan Nian, Yu-Ren PENG, Yao-Hsiang Liang, Ting-Chun Wang | 2023-03-14 |
| 11598016 | Electrochemical plating system and method of using | Jun-Nan Nian, Ting-Chun Wang, Ing-Ju Lee | 2023-03-07 |
| 11551979 | Method for manufacturing semiconductor structure | Chen Cheng Chou, Cheng-Ta Wu | 2023-01-10 |