Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854980 | Method for forming titanium nitride barrier with small surface grains in interconnects | Chi-Ming Lu, Jung-Chih Tsao, Chih-Chang Huang, Han-Chieh Huang | 2023-12-26 |
| 11603602 | Method for controlling electrochemical deposition to avoid defects in interconnect structures | Jun-Nan Nian, Shiu-Ko JangJian, Yu-Ren PENG, Ting-Chun Wang | 2023-03-14 |