Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11603602 | Method for controlling electrochemical deposition to avoid defects in interconnect structures | Shiu-Ko JangJian, Yu-Ren PENG, Yao-Hsiang Liang, Ting-Chun Wang | 2023-03-14 |
| 11598016 | Electrochemical plating system and method of using | Shiu-Ko JangJian, Ting-Chun Wang, Ing-Ju Lee | 2023-03-07 |