Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11658105 | Semiconductor package and manufacturing method thereof | Ching-Feng Yang, Hung-Jui Kuo, Kai-Chiang Wu, Ming-Che Ho | 2023-05-23 |
TH
Tuan-Yu Hung
Overall (2023): #219,591 of 537,848Top 45%
1
Patents 2023