Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11545457 | Semiconductor package, redistribution structure and method for forming the same | Hung-Jui Kuo, Ming-Che Ho | 2023-01-03 |
CL
Chiang-Hao Lee
Overall (2023): #488,361 of 537,848Top 95%
1
Patents 2023