Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854927 | Semiconductor package and method of forming same | Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2023-12-26 |
TT
Ting-Chen Tseng
Overall (2023): #225,686 of 537,848Top 45%
1
Patents 2023