Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11851321 | Micro-electro mechanical system and manufacturing method thereof | Ting-Li Yang, Kai-Di Wu, Ming-Da Cheng, Wen-Hsiung Lu, Chin Wei Kang | 2023-12-26 |
| 11742204 | Multi-layer structures and methods of forming | Chang-Jung Hsueh, Chen-En Yen, Chin Wei Kang, Kai Jun Zhan, Wei-Hung Lin +3 more | 2023-08-29 |
| 11569419 | Semiconductor device and manufacturing method thereof | Chen-En Yen, Ming-Da Cheng, Mirng-Ji Lii, Wen-Hsiung Lu, Chin Wei Kang +1 more | 2023-01-31 |