Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854964 | Structure and formation method of semiconductor device with conductive bumps | Ming-Da Cheng, Wei-Hung Lin, Hui-Min Huang, Po-Hao Tsai, Yung-Sheng Lin | 2023-12-26 |
| 11855058 | Package structure and method of forming the same | Wei-Hung Lin, Hui-Min Huang, Wan-Yu Chiang, Ming-Da Cheng, Mirng-Ji Lii | 2023-12-26 |
| 11742204 | Multi-layer structures and methods of forming | Chen-En Yen, Chin Wei Kang, Kai Jun Zhan, Wei-Hung Lin, Cheng-Jen Lin +3 more | 2023-08-29 |
| 11569419 | Semiconductor device and manufacturing method thereof | Chen-En Yen, Ming-Da Cheng, Mirng-Ji Lii, Wen-Hsiung Lu, Cheng-Jen Lin +1 more | 2023-01-31 |