Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721598 | Method of forming semiconductor device package having testing pads on an upper die | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Hui Liu | 2023-08-08 |
CY
Ching-Pin Yuan
Overall (2023): #481,950 of 537,848Top 90%
1
Patents 2023