Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855045 | Semiconductor device with discrete blocks | Chen-Shien Chen, Wei Sen Chang, Shou-Cheng Hu | 2023-12-26 |
| 11769741 | Organic interposer including a dual-layer inductor structure and methods of forming the same | Wei-Han Chiang, Ming-Da Cheng, Ching-Ho Cheng, Wei Sen Chang, Hong-Seng Shue +1 more | 2023-09-26 |
| 11742298 | Alignment mark design for packages | Li-Hsien Huang, Hsien-Wei Chen, Der-Chyang Yeh, Shin-Puu Jeng, Chen-Hua Yu | 2023-08-29 |
| 11688708 | Chip structure and method for forming the same | Shan-Yu Huang, Ming-Da Cheng, Hsiao-Wen Chung, LI-CHUN HUNG, Yuan-Yao Chang +1 more | 2023-06-27 |