Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11688708 | Chip structure and method for forming the same | Shan-Yu Huang, Ming-Da Cheng, Hsiao-Wen Chung, Ching-Wen Hsiao, Yuan-Yao Chang +1 more | 2023-06-27 |
| 11552120 | Chip-scale sensor package structure | Fu-Chou Liu, CHIEN-CHEN LEE, Ya-Han Chang | 2023-01-10 |