Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11552120 | Chip-scale sensor package structure | CHIEN-CHEN LEE, LI-CHUN HUNG, Ya-Han Chang | 2023-01-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11552120 | Chip-scale sensor package structure | CHIEN-CHEN LEE, LI-CHUN HUNG, Ya-Han Chang | 2023-01-10 |