Issued Patents 2023
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11844162 | Initialization method of human-factor lamps capable of intelligently adjusting ambient light | Yung-Hong Wang | 2023-12-12 |
| 11792497 | Sensor lens assembly having non-reflow configuration | Chia-Shuai Chang, Jui-Hung Hsu | 2023-10-17 |
| 11776975 | Sensor package structure | Jui-Hung Hsu, Ya-Han Chang | 2023-10-03 |
| 11744010 | Sensor lens assembly having non-reflow configuration | Chia-Shuai Chang, Ya-Han Chang | 2023-08-29 |
| 11735562 | Sensor package structure | Chen Peng | 2023-08-22 |
| 11723147 | Sensor lens assembly having non-reflow configuration | Chia-Shuai Chang, Jui-Hung Hsu | 2023-08-08 |
| 11683873 | Energy-saving street light system with dynamic and real-time brightness adjustment | Yung-Hong Wang | 2023-06-20 |
| 11676938 | Semiconductor device and method of making wafer level chip scale package | Ming-Che Hsieh, Baw-Ching Perng | 2023-06-13 |
| 11596042 | Initialization method of human-factor lamps capable of intelligently adjusting ambient light | Yung-Hong Wang | 2023-02-28 |
| 11552120 | Chip-scale sensor package structure | Fu-Chou Liu, LI-CHUN HUNG, Ya-Han Chang | 2023-01-10 |
| 11543112 | Human-factor lamp capable of intelligently adjusting ambient light and system thereof | Yung-Hong Wang, Brian A Cook | 2023-01-03 |