Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776975 | Sensor package structure | CHIEN-CHEN LEE, Jui-Hung Hsu | 2023-10-03 |
| 11744010 | Sensor lens assembly having non-reflow configuration | Chia-Shuai Chang, CHIEN-CHEN LEE | 2023-08-29 |
| 11552120 | Chip-scale sensor package structure | Fu-Chou Liu, CHIEN-CHEN LEE, LI-CHUN HUNG | 2023-01-10 |