Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11792497 | Sensor lens assembly having non-reflow configuration | CHIEN-CHEN LEE, Jui-Hung Hsu | 2023-10-17 |
| 11764240 | Method of manufacturing image sensing chip package structure including an adhesive loop | — | 2023-09-19 |
| 11744010 | Sensor lens assembly having non-reflow configuration | CHIEN-CHEN LEE, Ya-Han Chang | 2023-08-29 |
| 11723147 | Sensor lens assembly having non-reflow configuration | CHIEN-CHEN LEE, Jui-Hung Hsu | 2023-08-08 |