Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11676938 | Semiconductor device and method of making wafer level chip scale package | Ming-Che Hsieh, CHIEN-CHEN LEE | 2023-06-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11676938 | Semiconductor device and method of making wafer level chip scale package | Ming-Che Hsieh, CHIEN-CHEN LEE | 2023-06-13 |