Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810833 | Package structure and method and equipment for forming the same | Tsung-Yu Chen, Tsung-Shu Lin, Chen-Hsiang Lao, Wen-Hsin Wei, Hsien-Pin Hu | 2023-11-07 |
| 11721602 | Semiconductor package with stiffener structure | Yu-Ling Tsai, Chien-Chia Chiu, Tsung-Yu Chen | 2023-08-08 |
| 11715675 | Semiconductor device and manufacturing method thereof | Ping-Kang Huang, Sao-Ling Chiu, Tsung-Yu Chen, Tsung-Shu Lin, Chien-Yuan Huang +1 more | 2023-08-01 |
| 11594469 | Semiconductor device and method of manufacture | Shih-Chang Ku, Hung-Chi Li, Tsung-Shu Lin, Tsung-Yu Chen | 2023-02-28 |
| 11587845 | Semiconductor structure | Chi-Hsi Wu, Tsung-Shu Lin, Shih-Chang Ku, Tsung-Yu Chen, Hung-Chi Li | 2023-02-21 |