Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854956 | Semiconductor die package with conductive line crack prevention design | Shu-Shen Yeh, Kuo-Ching Hsu, Shyue-Ter Leu, Po-Yao Lin, Shin-Puu Jeng | 2023-12-26 |
YL
Ya Huei Lee
Overall (2023): #200,169 of 537,848Top 40%
1
Patents 2023