Issued Patents 2023
Showing 1–25 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855004 | Package structure | Chia-Kuei Hsu, Ming-Chih Yew, Che-Chia Yang, Po-Yao Lin, Shin-Puu Jeng | 2023-12-26 |
| 11855009 | Chip package with lid | Chin-Hua Wang, Kuang-Chun Lee, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng | 2023-12-26 |
| 11855008 | Stacking via structures for stress reduction | Che-Chia Yang, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng, Chia-Hsiang Lin | 2023-12-26 |
| 11854956 | Semiconductor die package with conductive line crack prevention design | Ya Huei Lee, Kuo-Ching Hsu, Shyue-Ter Leu, Po-Yao Lin, Shin-Puu Jeng | 2023-12-26 |
| 11854929 | Semiconductor package and method of forming the same | Yu-Sheng Lin, Chin-Hua Wang, Chien-Hung Chen, Po-Yao Lin, Shin-Puu Jeng | 2023-12-26 |
| 11830800 | Metallization structure and package structure | Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2023-11-28 |
| 11830859 | Package structures and method for forming the same | Chin-Hua Wang, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng | 2023-11-28 |
| 11823887 | Package structure and method of fabricating the same | Yu-Sheng Lin, Han-Hsiang Huang, Chien-Sheng Chen, Shin-Puu Jeng | 2023-11-21 |
| 11823991 | Frames stacked on substrate encircling devices and manufacturing method thereof | Chien-Hung Chen, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2023-11-21 |
| 11798897 | Package structure and methods of manufacturing the same | Po-Yao Lin, Chin-Hua Wang, Chia-Kuei Hsu, Shin-Puu Jeng | 2023-10-24 |
| 11784061 | Chip package structure and method for forming the same | Yu-Sheng Lin, Po-Yao Lin, Chin-Hua Wang, Shin-Puu Jeng | 2023-10-10 |
| 11784130 | Structure and formation method of package with underfill | Yu-Sheng Lin, Shin-Puu Jeng, Po-Yao Lin, Chin-Hua Wang, Che-Chia Yang | 2023-10-10 |
| 11756854 | Package structure and method of fabricating the same | Yu-Sheng Lin, Po-Yao Lin, Chin-Hua Wang, Shin-Puu Jeng | 2023-09-12 |
| 11749644 | Semiconductor device with curved conductive lines and method of forming the same | Chia-Kuei Hsu, Ming-Chih Yew, Che-Chia Yang, Po-Yao Lin, Shin-Puu Jeng | 2023-09-05 |
| 11742322 | Integrated fan-out package having stress release structure | Ming-Chih Yew, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng | 2023-08-29 |
| 11728233 | Chip package structure with ring structure and method for forming the same | Po-Yao Lin, Shin-Puu Jeng, Po-Chen Lai, Kuang-Chun Lee, Che-Chia Yang +2 more | 2023-08-15 |
| 11721643 | Package structure | Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Che-Chia Yang, Po-Yao Lin +1 more | 2023-08-08 |
| 11721644 | Semiconductor package with riveting structure between two rings and method for forming the same | Chien-Hung Chen, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng | 2023-08-08 |
| 11715731 | Package structure and method of forming the same | Po-Yao Lin, Chin-Hua Wang, Yu-Sheng Lin, Shin-Puu Jeng | 2023-08-01 |
| 11699668 | Semiconductor device package having warpage control and method of forming the same | Che-Chia Yang, Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2023-07-11 |
| 11699631 | Semiconductor device and manufacturing method thereof | Po-Yao Lin, Hui Yu, Shyue-Ter Leu, Shin-Puu Jeng | 2023-07-11 |
| 11694941 | Semiconductor die package with multi-lid structures and method for forming the same | Che-Chia Yang, Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2023-07-04 |
| 11694974 | Semiconductor die with warpage release layer structure in package and fabricating method thereof | Chin-Hua Wang, Kuang-Chun Lee, Tsung-Yen Lee, Po-Yao Lin, Shin-Puu Jeng | 2023-07-04 |
| 11682602 | Semiconductor device and method of manufacture | Chin-Hua Wang, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng | 2023-06-20 |
| 11676826 | Semiconductor die package with ring structure for controlling warpage of a package substrate | Yu-Sheng Lin, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2023-06-13 |