Issued Patents 2023
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854929 | Semiconductor package and method of forming the same | Chin-Hua Wang, Shu-Shen Yeh, Chien-Hung Chen, Po-Yao Lin, Shin-Puu Jeng | 2023-12-26 |
| 11823991 | Frames stacked on substrate encircling devices and manufacturing method thereof | Chien-Hung Chen, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2023-11-21 |
| 11823887 | Package structure and method of fabricating the same | Han-Hsiang Huang, Chien-Sheng Chen, Shu-Shen Yeh, Shin-Puu Jeng | 2023-11-21 |
| 11815369 | Differential capacitor device and method for calibrating differential capacitor | Lu-Po Liao, Chin-Fu Kuo, Liang-Ying Liu | 2023-11-14 |
| 11784130 | Structure and formation method of package with underfill | Shin-Puu Jeng, Po-Yao Lin, Chin-Hua Wang, Shu-Shen Yeh, Che-Chia Yang | 2023-10-10 |
| 11784061 | Chip package structure and method for forming the same | Po-Yao Lin, Shu-Shen Yeh, Chin-Hua Wang, Shin-Puu Jeng | 2023-10-10 |
| 11756854 | Package structure and method of fabricating the same | Po-Yao Lin, Shu-Shen Yeh, Chin-Hua Wang, Shin-Puu Jeng | 2023-09-12 |
| 11739450 | Circular knitting machine for prompting knitting machine status instantaneously based on cloth surface status of fabric | Hsien-Te Tsai | 2023-08-29 |
| 11715731 | Package structure and method of forming the same | Po-Yao Lin, Shu-Shen Yeh, Chin-Hua Wang, Shin-Puu Jeng | 2023-08-01 |
| 11676916 | Structure and formation method of package with warpage-control element | Chien-Hung Chen, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng | 2023-06-13 |
| 11676826 | Semiconductor die package with ring structure for controlling warpage of a package substrate | Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2023-06-13 |
| 11656909 | Tensor accelerator capable of increasing efficiency of data sharing | Shao-Yi Chien, Wei-Chao Chen | 2023-05-23 |
| 11580621 | AI frame engine for mobile edge | Jen Cheng LUNG, Pei-Kuei Tsung, Chih-Wei Chen, Yao-Sheng Wang, Shih-Che Chen +4 more | 2023-02-14 |
| 11574861 | Semiconductor package | Chin-Hua Wang, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2023-02-07 |
| 11543297 | Sensing devices | Ying-Che Lo, Ting-Hao Hsiao, Bor-Shiun Lee | 2023-01-03 |