Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854837 | Semiconductor devices and methods of manufacturing | Po-Chen Lai, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2023-12-26 |
| 11823887 | Package structure and method of fabricating the same | Yu-Sheng Lin, Han-Hsiang Huang, Shu-Shen Yeh, Shin-Puu Jeng | 2023-11-21 |
| 11768786 | Connection interface conversion chip, connection interface conversion device and operation method | Cheng-Chung Lin, Hsiao-Chyi Lin, Yi-Shing Lin | 2023-09-26 |