Issued Patents 2023
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854837 | Semiconductor devices and methods of manufacturing | Ming-Chih Yew, Po-Yao Lin, Chien-Sheng Chen, Shin-Puu Jeng | 2023-12-26 |
| 11830859 | Package structures and method for forming the same | Chin-Hua Wang, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2023-11-28 |
| 11742322 | Integrated fan-out package having stress release structure | Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2023-08-29 |
| 11728284 | Chip package structure and method for forming the same | Chin-Hua Wang, Ming-Chih Yew, Chia-Kuei Hsu, Li-Ling Liao, Po-Yao Lin +1 more | 2023-08-15 |
| 11728233 | Chip package structure with ring structure and method for forming the same | Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng, Kuang-Chun Lee, Che-Chia Yang +2 more | 2023-08-15 |
| 11721644 | Semiconductor package with riveting structure between two rings and method for forming the same | Chien-Hung Chen, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2023-08-08 |
| 11721643 | Package structure | Chin-Hua Wang, Ming-Chih Yew, Che-Chia Yang, Shu-Shen Yeh, Po-Yao Lin +1 more | 2023-08-08 |
| 11705406 | Package structure and method for forming the same | Chin-Hua Wang, Ming-Chih Yew, Li-Ling Liao, Tsung-Yen Lee, Po-Yao Lin +1 more | 2023-07-18 |
| 11676916 | Structure and formation method of package with warpage-control element | Yu-Sheng Lin, Chien-Hung Chen, Po-Yao Lin, Shin-Puu Jeng | 2023-06-13 |
| 11652037 | Semiconductor package and method of manufacture | Chia-Kuei Hsu, Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2023-05-16 |
| 11637087 | Multi-chip device and method of formation | Chin-Hua Wang, Shu-Shen Yeh, Tsung-Yen Lee, Po-Yao Lin, Shin-Puu Jeng | 2023-04-25 |