Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756873 | Semiconductor package and manufacturing method thereof | Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2023-09-12 |
| 11703763 | Method of lithography process using reticle container with discharging device | Hsiao-Lun Chang, Chueh-Chi Kuo, Tzung-Chi Fu, Li-Jui Chen, Po-Chung Cheng +1 more | 2023-07-18 |
| 11705406 | Package structure and method for forming the same | Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Li-Ling Liao, Po-Yao Lin +1 more | 2023-07-18 |
| 11705420 | Multi-bump connection to interconnect structure and manufacturing method thereof | Chia-Kuei Hsu, Shang-Lun Tsai, Ming-Chih Yew, Po-Yao Lin | 2023-07-18 |
| 11694974 | Semiconductor die with warpage release layer structure in package and fabricating method thereof | Chin-Hua Wang, Kuang-Chun Lee, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2023-07-04 |
| 11675280 | Lithography system and method | Hao-Yu Lan, Po-Chung Cheng, Ching-Juinn Huang, Tzung-Chi Fu | 2023-06-13 |
| 11637087 | Multi-chip device and method of formation | Chin-Hua Wang, Po-Chen Lai, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2023-04-25 |
| 11557559 | Package structure | Chin-Hua Wang, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2023-01-17 |