Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705420 | Multi-bump connection to interconnect structure and manufacturing method thereof | Tsung-Yen Lee, Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin | 2023-07-18 |
ST
Shang-Lun Tsai
Overall (2023): #253,308 of 537,848Top 50%
1
Patents 2023