Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728284 | Chip package structure and method for forming the same | Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Chia-Kuei Hsu, Po-Yao Lin +1 more | 2023-08-15 |
| 11705406 | Package structure and method for forming the same | Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Tsung-Yen Lee, Po-Yao Lin +1 more | 2023-07-18 |
| 11610835 | Organic interposer including intra-die structural reinforcement structures and methods of forming the same | Ming-Chih Yew, Chia-Kuei Hsu, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2023-03-21 |