Issued Patents 2023
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854929 | Semiconductor package and method of forming the same | Yu-Sheng Lin, Chin-Hua Wang, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2023-12-26 |
| 11852849 | Camera device | Ming-Wei Shih, Hsi-Ling Chang | 2023-12-26 |
| 11823991 | Frames stacked on substrate encircling devices and manufacturing method thereof | Shu-Shen Yeh, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2023-11-21 |
| 11721644 | Semiconductor package with riveting structure between two rings and method for forming the same | Shu-Shen Yeh, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng | 2023-08-08 |
| 11721745 | Methods for increasing germanium concentration of surfaces of a silicon germanium portion of a fin and resulting semiconductor devices | Che-Yu Lin, Wen-Chu Hsiao | 2023-08-08 |
| 11703541 | Semiconductor inspecting method for ensuring scrubbing length on pad | Volker Hansel, Sebastian Giessmann, Frank Fehrmann | 2023-07-18 |
| 11693050 | Semiconductor inspecting method | Volker Hansel, Sebastian Giessmann, Frank Fehrmann | 2023-07-04 |
| 11676916 | Structure and formation method of package with warpage-control element | Yu-Sheng Lin, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng | 2023-06-13 |
| 11668902 | Lens assembly | Guo-Yang Wu, Bo-Yan Chen, Hsi-Ling Chang, Chun-Yang Yao | 2023-06-06 |
| 11637072 | Semiconductor package and method of manufacturing the same | Kai-Ming Ching, Shu-Shen Yeh, Hui Yu, Yu-Min Cheng | 2023-04-25 |
| 11569084 | Method for manufacturing semiconductor structure with reduced nodule defects | Che-Yu Lin, Chih-Chiang Chang, Ming-Hua Yu, Tsung-Hsi Yang, Ting-Yi HUANG +2 more | 2023-01-31 |