Issued Patents 2023
Showing 26–32 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11670601 | Stacking via structures for stress reduction | Che-Chia Yang, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng, Chia-Hsiang Lin | 2023-06-06 |
| 11652037 | Semiconductor package and method of manufacture | Chia-Kuei Hsu, Ming-Chih Yew, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng | 2023-05-16 |
| 11637072 | Semiconductor package and method of manufacturing the same | Kai-Ming Ching, Chien-Hung Chen, Hui Yu, Yu-Min Cheng | 2023-04-25 |
| 11637087 | Multi-chip device and method of formation | Chin-Hua Wang, Po-Chen Lai, Tsung-Yen Lee, Po-Yao Lin, Shin-Puu Jeng | 2023-04-25 |
| 11610835 | Organic interposer including intra-die structural reinforcement structures and methods of forming the same | Li-Ling Liao, Ming-Chih Yew, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng | 2023-03-21 |
| 11594477 | Semiconductor package and method of manufacturing semiconductor package | Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2023-02-28 |
| 11574861 | Semiconductor package | Chin-Hua Wang, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2023-02-07 |