Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855008 | Stacking via structures for stress reduction | Shu-Shen Yeh, Che-Chia Yang, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2023-12-26 |
| 11670601 | Stacking via structures for stress reduction | Shu-Shen Yeh, Che-Chia Yang, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2023-06-06 |
| 11605600 | Package structure with reinforced element and formation method thereof | Shin-Puu Jeng, Po-Yao Lin, Shuo-Mao Chen | 2023-03-14 |