YL

Yen-Liang Lin

TSMC: 11 patents #248 of 4,064Top 7%
AM Amazon: 1 patents #1,205 of 4,574Top 30%
GE: 1 patents #858 of 2,636Top 35%
📍 Ganzikeng, CA: #1 of 3 inventorsTop 35%
Overall (2023): #4,459 of 537,848Top 1%
13
Patents 2023

Issued Patents 2023

Showing 1–13 of 13 patents

Patent #TitleCo-InventorsDate
11855118 Image sensor device Chia-Yu Wei, Kuo-Cheng Lee, Hsun-Ying Huang, Hsin-Chi Chen 2023-12-26
11843007 CMOS image sensor having indented photodiode structure Chia-Yu Wei, Hsin-Chi Chen, Kuo-Cheng Lee, Ping-Hao Lin, Hsun-Ying Huang +1 more 2023-12-12
11817472 Anchor structures and methods for uniform wafer planarization and bonding Chia-Yu Wei, Cheng-Yuan Li, Hsin-Chi Chen, Kuo-Cheng Lee, Hsun-Ying Huang 2023-11-14
11791299 Redistribution layer (RDL) layouts for integrated circuits Cheng-Yuan Li, Kuo-Cheng Lee, Yun-Wei Cheng 2023-10-17
11784198 Wide channel semiconductor device Chia-Yu Wei, Fu-Cheng Chang, Hsin-Chi Chen, Ching-Hung Kao, Chia-Pin Cheng +2 more 2023-10-10
11715646 Semiconductor structure and method for forming the same Jen-Fu Liu, Ming Hung Tseng, Li-Ko Yeh, Hui-Chun Chiang, Cheng-Chieh Wu 2023-08-01
11682655 Semiconductor packages and methods of forming the same Chen-Hua Yu, Ming Hung Tseng, Tzu-Sung Huang, Tin-Hao Kuo, Hao-Yi Tsai 2023-06-20
11664325 Semiconductor structure and method of fabricating the same Tzu-Sung Huang, Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo +4 more 2023-05-30
11645693 Complementary consumer item selection Son Dinh Tran, Larry Davis 2023-05-09
11631993 Wireless charging devices having wireless charging coils and methods of manufacture thereof Chen-Hua Yu, Chita Chuang, Chen-Shien Chen, Ming Hung Tseng, Sen-Kuei Hsu +1 more 2023-04-18
11631648 Bump structure having a side recess and semiconductor structure including the same Chih-Horng Chang, Tin-Hao Kuo, Chen-Shien Chen 2023-04-18
11626339 Integrated circuit package and method Tzu-Sung Huang, Ming Hung Tseng, Hao-Yi Tsai, Chi-Ming Tsai, Chung-Shi Liu +2 more 2023-04-11
11544900 Primitive-based 3D building modeling, sensor simulation, and estimation Xia Li, James Vradenburg Miller, Walter Vincent Dixon 2023-01-03