Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817472 | Anchor structures and methods for uniform wafer planarization and bonding | Chia-Yu Wei, Hsin-Chi Chen, Kuo-Cheng Lee, Hsun-Ying Huang, Yen-Liang Lin | 2023-11-14 |
| 11791299 | Redistribution layer (RDL) layouts for integrated circuits | Kuo-Cheng Lee, Yun-Wei Cheng, Yen-Liang Lin | 2023-10-17 |