Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11809000 | Photonic integrated circuit and package structure | Tsung-Yuan Yu, Hung-Yi Kuo, Cheng-Chieh Hsieh, Hao-Yi Tsai, Chung-Ming Weng +1 more | 2023-11-07 |
| 11768338 | Optical interconnect structure, package structure and fabricating method thereof | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh +5 more | 2023-09-26 |
| 11754780 | Semiconductor package and manufacturing method thereof | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh +5 more | 2023-09-12 |
| 11686908 | Photonic semiconductor device and method of manufacture | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh +3 more | 2023-06-27 |
| 11640935 | Semiconductor package and manufacturing method thereof | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh +7 more | 2023-05-02 |
| 11614592 | Semiconductor devices and methods of manufacture | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh +4 more | 2023-03-28 |