Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11809000 | Photonic integrated circuit and package structure | Hung-Yi Kuo, Cheng-Chieh Hsieh, Hao-Yi Tsai, Chung-Ming Weng, Hua-Kuei Lin +1 more | 2023-11-07 |
| 11768338 | Optical interconnect structure, package structure and fabricating method thereof | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh +5 more | 2023-09-26 |
| 11754780 | Semiconductor package and manufacturing method thereof | Chung-Ming Weng, Hua-Kuei Lin, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai +5 more | 2023-09-12 |
| 11754794 | Semiconductor device including optical through via and method of making | Yu-Hao Chen, Chung-Ming Weng, Hui Yu Lee, Hung-Yi Kuo, Jui-Feng Kuan +1 more | 2023-09-12 |
| 11686908 | Photonic semiconductor device and method of manufacture | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh +3 more | 2023-06-27 |
| 11640935 | Semiconductor package and manufacturing method thereof | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh +7 more | 2023-05-02 |
| 11614592 | Semiconductor devices and methods of manufacture | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh +4 more | 2023-03-28 |