Issued Patents 2023
Showing 51–74 of 74 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11699638 | Package and manufacturing method thereof | Sung-Feng Yeh, Jian-Wei Hong | 2023-07-11 |
| 11676942 | Semiconductor structure and method of manufacturing the same | Hsien-Wei Chen, Sung-Feng Yeh | 2023-06-13 |
| 11676908 | System and method for aligned stitching | Chih-Chia Hu, Chang-Ching Yu | 2023-06-13 |
| 11670621 | Die stack structure | Jie Chen, Hsien-Wei Chen | 2023-06-06 |
| 11670617 | Packages formed using RDL-last process | Chen-Hua Yu | 2023-06-06 |
| 11664349 | Stacked chip package and methods of manufacture thereof | Chen-Hua Yu, Sung-Feng Yeh | 2023-05-30 |
| 11664336 | Bonding structure and method of forming same | Hsien-Wei Chen, Jie Chen | 2023-05-30 |
| 11656128 | Microelectromechanical infrared sensing device and fabrication method thereof | Chin-Jou Kuo, Bor-Shiun Lee | 2023-05-23 |
| 11658150 | System on integrated chips and methods of forming same | Sung-Feng Yeh, Chen-Hua Yu | 2023-05-23 |
| 11658069 | Method for manufacturing a semiconductor device having an interconnect structure over a substrate | Tzuan-Horng Liu, Chao-Wen Shih | 2023-05-23 |
| 11621214 | Semiconductor package and method for manufacturing the same | Hsien-Wei Chen, Jie Chen | 2023-04-04 |
| 11609391 | Semiconductor package and manufacturing method thereof | Hsien-Wei Chen, Jie Chen | 2023-03-21 |
| 11610858 | Packages with Si-substrate-free interposer and method forming same | Chen-Hua Yu | 2023-03-21 |
| 11600551 | Through-silicon via with low-K dielectric liner | — | 2023-03-07 |
| 11587907 | Package structure | Tzuan-Horng Liu, Hsien-Wei Chen, Jiun-Heng Wang | 2023-02-21 |
| 11587922 | Process control for package formation | Hsien-Wei Chen | 2023-02-21 |
| 11587894 | Package and method of fabricating the same | Chao-Wen Shih, Tzuan-Horng Liu, Jen-Li Hu | 2023-02-21 |
| 11574878 | Semiconductor structure and manufacturing method thereof | Tzuan-Horng Liu, Hsien-Wei Chen | 2023-02-07 |
| 11574847 | Seal ring between interconnected chips mounted on an integrated circuit | Hsien-Wei Chen, Jie Chen, Chih-Chia Hu | 2023-02-07 |
| 11562982 | Integrated circuit packages and methods of forming the same | Chih-Chia Hu, Sung-Feng Yeh | 2023-01-24 |
| 11562983 | Package having multiple chips integrated therein and manufacturing method thereof | Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2023-01-24 |
| 11562935 | Semiconductor structure | Hsien-Wei Chen, Ching-Jung Yang | 2023-01-24 |
| 11557581 | Package structure and method of fabricating the same | Hsien-Wei Chen, Jie Chen | 2023-01-17 |
| 11552074 | Package structures and methods of fabricating the same | Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2023-01-10 |