Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11699638 | Package and manufacturing method thereof | Ming-Fa Chen, Sung-Feng Yeh | 2023-07-11 |
JH
Jian-Wei Hong
Overall (2023): #397,528 of 537,848Top 75%
1
Patents 2023