Issued Patents 2023
Showing 26–50 of 74 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784163 | Stacking structure, package structure and method of fabricating the same | Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2023-10-10 |
| 11769718 | Packages with Si-substrate-free interposer and method forming same | Chen-Hua Yu | 2023-09-26 |
| 11769724 | Package having different metal densities in different regions and manufacturing method thereof | Hsien-Wei Chen, Jie Chen, Sen-Bor Jan | 2023-09-26 |
| 11769704 | Semiconductor structure having an anti-arcing pattern disposed on a passivation layer and a post passivation layer disposed on the anti-arcing pattern | Sheng-An Kuo, Ching-Jung Yang, Hsien-Wei Chen, Jie Chen | 2023-09-26 |
| 11756907 | Bonding structure and method of forming same | Sung-Feng Yeh, Hsien-Wei Chen, Jie Chen | 2023-09-12 |
| 11756933 | Inactive structure on SoIC | Sung-Feng Yeh, Hsien-Wei Chen | 2023-09-12 |
| 11756901 | Seal ring for hybrid-bond | Chih-Chia Hu, Chun-Chiang Kuo, Sen-Bor Jan, Hsien-Wei Chen | 2023-09-12 |
| 11748544 | Method of manufacturing integrated circuit having through-substrate via | Chih-Chia Hu, Sen-Bor Jan, Meng-Wei Chiang | 2023-09-05 |
| 11749729 | Semiconductor device, integrated circuit component and manufacturing methods thereof | — | 2023-09-05 |
| 11742297 | Semiconductor packages | Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2023-08-29 |
| 11735536 | Semiconductor package and manufacturing method thereof | Hsien-Wei Chen, Sen-Bor Jan, Chih-Chia Hu | 2023-08-22 |
| 11735487 | Semiconductor structure and method of fabricating the same | Hsien-Wei Chen, Ying-Ju Chen | 2023-08-22 |
| 11735544 | Semiconductor packages with stacked dies and methods of forming the same | Hsien-Wei Chen, Sung-Feng Yeh, Jie Chen | 2023-08-22 |
| 11728324 | Semiconductor structure having photonic die and electronic die | Hsien-Wei Chen | 2023-08-15 |
| 11728312 | Semiconductor packaging and methods of forming same | Hsien-Wei Chen | 2023-08-15 |
| 11728275 | Semiconductor package and manufacturing method thereof | Hsien-Wei Chen, Jie Chen, Sung-Feng Yeh | 2023-08-15 |
| 11728247 | Manufacturing method of semiconductor structure | Chih-Chia Hu, Hsien-Wei Chen, Sen-Bor Jan | 2023-08-15 |
| 11721598 | Method of forming semiconductor device package having testing pads on an upper die | Chen-Hua Yu, Sung-Feng Yeh, Hsien-Wei Chen, Hui Liu, Ching-Pin Yuan | 2023-08-08 |
| 11721663 | Multi-level stacking of wafers and chips | Cheng-Feng Chen, Sung-Feng Yeh, Chuan-An Cheng | 2023-08-08 |
| 11715755 | Structure and method for forming integrated high density MIM capacitor | Hsien-Wei Chen, Ying-Ju Chen, Jie Chen | 2023-08-01 |
| 11715723 | Wafer on wafer bonding structure | Chao-Wen Shih, Sung-Feng Yeh | 2023-08-01 |
| 11705423 | Package structure | Sung-Feng Yeh, Hsien-Wei Chen | 2023-07-18 |
| 11705343 | Integrated circuit package and method of forming thereof | Hsien-Wei Chen, Ying-Ju Chen | 2023-07-18 |
| 11699663 | Passivation scheme design for wafer singulation | Hsien-Wei Chen, Ying-Ju Chen | 2023-07-11 |
| 11699694 | Method of manufacturing semiconductor package structure | Yi-Hsiu Chen, Chen-Hua Yu, Wen-Chih Chiou | 2023-07-11 |