Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721663 | Multi-level stacking of wafers and chips | Ming-Fa Chen, Sung-Feng Yeh, Chuan-An Cheng | 2023-08-08 |
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Cheng-Feng Chen
Overall (2023): #493,305 of 537,848Top 95%
1
Patents 2023