Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721663 | Multi-level stacking of wafers and chips | Ming-Fa Chen, Cheng-Feng Chen, Sung-Feng Yeh | 2023-08-08 |
CC
Chuan-An Cheng
Overall (2023): #493,079 of 537,848Top 95%
1
Patents 2023