Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11823989 | Multi-liner TSV structure and method forming same | Ming-Fa Chen, Chao-Wen Shih | 2023-11-21 |
CW
Chin-Shyh Wang
Overall (2023): #483,211 of 537,848Top 90%
1
Patents 2023