Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728314 | Methods of forming integrated circuit packages | Yung-Chi Lin, Wen-Chih Chiou | 2023-08-15 |
| 11728238 | Semiconductor package with heat dissipation films and manufacturing method thereof | Ting-Yu Yeh, Cing-He Chen, Kuo-Chiang Ting, Weiming Chris Chen | 2023-08-15 |
| 11705413 | Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure | Tai-Yu Chen, Shiann-Tsong Tsai, Hsing-Chih Liu, Yao-Pang Hsu, Chi-Yuan Chen +1 more | 2023-07-18 |
| 11660984 | Hardness adjustment unit, seat, and seat adjustment system | — | 2023-05-30 |
| 11640930 | Semiconductor package having liquid-cooling lid | Tai-Yu Chen, Sheng-Liang Kuo, Bo-Jiun Yang | 2023-05-02 |
| 11619978 | Electronic device and hinge structure | Cheng-Shiue Jan, Chien-Chu Chen, Wei-Hao Lan | 2023-04-04 |
| 11621211 | Semiconductor package structure | Ya-Jui Hsieh, Tai-Yu Chen, Yao-Pang Hsu | 2023-04-04 |