Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11640930 | Semiconductor package having liquid-cooling lid | Chia-Hao Hsu, Tai-Yu Chen, Sheng-Liang Kuo | 2023-05-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11640930 | Semiconductor package having liquid-cooling lid | Chia-Hao Hsu, Tai-Yu Chen, Sheng-Liang Kuo | 2023-05-02 |