Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728232 | Semiconductor package having a stiffener ring | Chi-Wen Pan, I-Hsuan Peng, Yi-Jou Lin, Tai-Yu Chen | 2023-08-15 |
| 11640930 | Semiconductor package having liquid-cooling lid | Chia-Hao Hsu, Tai-Yu Chen, Bo-Jiun Yang | 2023-05-02 |