Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854930 | Semiconductor chip package and fabrication method thereof | Yi-Lin Tsai, Yi-Jou Lin, Wen-Sung Hsu | 2023-12-26 |
| 11830820 | Electronic package with rotated semiconductor die | Yao-Chun Su, Chih-Jung Hsu, Yi-Jou Lin | 2023-11-28 |
| 11830851 | Semiconductor package structure | Yi-Lin Tsai, Wen-Sung Hsu, Yi-Jou Lin | 2023-11-28 |
| 11728292 | Semiconductor package assembly having a conductive electromagnetic shield layer | Tzu-Hung Lin, Nai-Wei Liu, Wei-Che Huang, Che-Ya Chou | 2023-08-15 |
| 11728232 | Semiconductor package having a stiffener ring | Chi-Wen Pan, Sheng-Liang Kuo, Yi-Jou Lin, Tai-Yu Chen | 2023-08-15 |
| 11688655 | Semiconductor package including lid structure with opening and recess | Chia-Cheng Chang, Tzu-Hung Lin, Nai-Wei Liu | 2023-06-27 |
| 11670596 | Semiconductor package structure | Yi-Lin Tsai, Wen-Sung Hsu, Yi-Jou Lin | 2023-06-06 |
| 11646295 | Semiconductor package structure having an annular frame with truncated corners | Chia-Cheng Chang, Tzu-Hung Lin, Yi-Jou Lin | 2023-05-09 |